FCMN 2011
36 Presentations
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Invited Oral Presentation: Fundamental Limits of Optical Defect Metrology
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Invited oral Presentation: Metrology for 3D Devices: Plasma-based FIB for High-throughput Sectioning of Large Dimensions
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Invited Oral Presentation: Wafer Inspection for Sub 20 nm Patterning
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Invited Oral Presentation: A Novel SPM System for Determining the Quantum Electrical Structure of Nanometer-scale Systems such as Graphene
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Invited Oral Presentation: Stress-induced Effects Caused by 3D IC TSV Packaging on Advanced Semiconductor Processes
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Invited Oral Presentation: Carbon Based Nanoelectronics
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Invited Oral Presentation: Advances in CD-Metrology (CD-SAXS, Muller Matrix based Scatterometry, and SEM)
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Invited Oral Presentation: Metrology at IMEC: a Center of Excellence Enabling Fundamental Understanding of Process and Materials Development
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Invited Oral Presentation: Line Edge Roughness of Directed Self Assembled PS-PMMA Block Copolymers - A Candidate for Future Lithography
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Invited Oral Presentation: Metrology for 3D IC Integration (including TSV)
