FCMN 2015
61 Presentations
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Keynote Talk: Techno-Economics Pressure In Semiconductor Value Chain May Impact Consumers And Global Economy - What Is Our Solution?
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Keynote Talk: Nanoelectronics for Metrology
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Invited Oral Presentation: Material Requirements for 3D IC and Packaging
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Invited Oral Presentation: Probing Optical and Electronic Properties of Defects Through Scanning Transmission Electron Microscopy and First-Principles Theory
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Invited Oral Presentation: High-resolution X-ray Diffraction of Epitaxial Thin-Films and Patterned Nanostructures
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Invited Oral Presentation: Characterization of Magnetic Nanostructures for STT-RAM Applications by Use of Macro- and Micro-Scale Ferromagnetic Resonance
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Invited Oral Presentation: XRD/TEM/EELS Studies on Memory Device Structures
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Invited Oral Presentation: Positron Annihilation Spectroscopy Measurements for Porosimetry Determination of Micro-and Meso-porous Systems
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Invited Oral Presentation: Imaging Electron Motion in Nanostructures
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Invited Oral Presentation: Advances in Atom Probe Metrology
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Invited Oral Presentation: Defect Inspection for Advanced Technology Nodes
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Invited Oral Presentation: Advances in Multi-Beam SEM Technology for High Throughput Defect Inspection
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Invited Oral Presentation: 2D Materials Beyond Graphene for Future Electronics
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Invited Oral presentation: Current Status of CDSAXS: Is it Fab-Ready?
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Invited Oral Presentation: CMOS Characterization/Metrology Challenges for the Lab to the Fab
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Invited Oral Presentation: Thermal Wave Analysis of Implanted Layers in Semiconductors: Measurement Performance vs. Process Requirements
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Invited Oral Presentation: Combined Nanoindentation and AFAM for Mechanical Characterization of Ultra Low-k Thin Films
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Invited Oral Presentation: Phase Change Properties and Strain Engineering in 2D Materials
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Invited Oral Presentation: DFM and DFR Requirements for 3D Stacked Systems to Materials Data and Characterization Techniques
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Invited Oral Presentation: X-ray Tomography for Process Development and Failure Analysis
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Invited Oral Presentation: New Scanning Acoustic Microscopy Technologies Applied to 3D Integration Applications
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Poster Presentation: Optical Constants of Ni1-xPtx and Ni1-xPtxSi for In-LineContact Metrology
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Poster Presentation: Metallic Contamination Analysis of 450 mm Wafers Using VPD-DC-ICPMS and LPD-ICPMSC.
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Poster Presentation: Positon Annihilation Spectroscopy: an Emerging Technique for Characterization of Oxygen Vacancies in Hf-based-high-k Materials
