Plasma Enhanced Atomic Layer Deposition of Aluminum and Aluminum Fluoride Presentation: Daniel Messina, Arizona State University, 1 slide
High-temperature Hollow Cathode Plasma Enhanced Atomic Layer Deposition of Silicon Nitride (SiNx) Thin Films using Hexachlorodisilane (HCDS) Presentation: Su Min Hwang, University of Texas at Dallas, 1 slide
Effects of Ion Bombardment in Plasma Enhanced Atomic Layer Deposition Processes Presentation: Hu Li, Tokyo Electron Technology Solutions Ltd., Japan, 1 slide
Improving Plasma Enhanced Atomic Layer Deposition of Silicon Nitride with A Halodisilane Presentation: Xiaobing Zhou, DuPont, 1 slide
Characteristics of Silicon Nitride Film Deposited by Multi-electrode VHF (162 MHz)-PEALD Presentation: Ki Hyun Kim, Sungkyunkwan University, Republic of Korea, 1 slide
Characteristics of Low Damage Cobalt Films Deposited by Very High Frequency Plasma Enhanced Atomic Layer Deposition Presentation: Changhoon Song, Sungkyunkwan University, Republic of Korea, 1 slide
Film Thickness and Trace Metal Analysis of Compound Semiconductor Stacks through Direct Film Stripping (DFS) followed by ICP-MS/OES Presentation: Vijay (Jaya) Chowdhury, ChemTrace, 1 slide
Overview of Doctoral Theses on Atomic Layer Deposition Worldwide - Outcome of the Virtual Project on the History of ALD Presentation: J. Ruud van Ommen, Delft University of Technology, Netherlands, 1 slide
The Effect of Impurities on Film Properties in the Y(MeCp)3/O3 Process Presentation: Jani Kivioja, Picosun Oy, Finland, 1 slide
Internal Photoemission Spectroscopy Measurement of Barrier Heights between ALD Ru and Al2O3 Presentation: Melanie Jenkins, Oregon State University, 1 slide
Growth and Characterization: Low Temperature ALD Presentation: Birol Kuyel, Nano-Master, Inc., 24 slides
Etch Rate Characterization of Oxide ALD Films Presentation: Martin M. Winterkorn, Stanford University, 1 slide
Mechanistic Thermal Desorption Studies of Thermal Dry Etching Reactions for Cobalt and Iron Thin Films Presentation: Mahsa Konh, University of Delaware, 1 slide
Mechanistic Study of the Thermal Atomic Layer Etch of Tungsten Metal Using O2 and WCl6 Presentation: Patrick Theofanis, Intel Corp., 1 slide
Atomic Layer Etching of Silicon Using a Conventional ICP Etch Chamber for Failure Analysis Applications Presentation: John Mudrick, Sandia National Laboratories, 1 slide
A Mechanistic Study of the HF Pulse in the Thermal Atomic Layer Etch of HfO2 and ZrO2 Presentation: Rita Mullins, Tyndall National Institute, Ireland, 1 slide
Atomic Layer Etching of SiO2 and Si3N4 with Fluorocarbon, Hydrofluorocarbon and Fluoroether Compounds Presentation: Yongjae Kim, Sungkyunkwan University (SKKU), Republic of Korea, 1 slide
Cyclic Etching of Copper Thin Films using Two Sequential Steps Presentation: Eun Tack Lim, Inha University, Republic of Korea, 1 slide
Analysis of Mechanisms Involved in Cryogenic ALE Presentation: Thomas Tillocher, GREMI Université d'Orléans/CNRS, France, 1 slide
Study on Dry Etching Characteristics of Germanium Oxide by Atomic Layer Deposition Presentation: Donghyuk Shin, Yonsei University, Republic of Korea, 1 slide
Cobalt Precursor Supply Chain - Ethics and Risks Presentation: Andreas Wilk, Umicore AG & Co. KG, Germany, 1 slide
Temperature-based Control of Liquid Precursor Delivery for ALD Processes Presentation: Egbert Woelk, CeeVeeTech, 1 slide
Design and Manufacturing of ICP-Type Remote Plasma ALD Presentation: Dohyun Go, Seoul National University of Science and Technology, Republic of Korea, 1 slide
ACS™ (Atomically Clean Surface™) Cleaning and Analytical Validation of Recycled ALD Chamber Parts for the Semiconductor Industry Presentation: Russell Parise, UCT - QuantumClean, 1 slide