ALD-ALE 2017 Presentations
363 Presentations
0 Sections
ALD/ALE 2017 Schedule
Atomic Layer Etching – An Overview of Possibilities and Limitations
Future Applications and Challenges for ALD in Microelectronics
Future Trends of Deposition Technologies in Semiconductor Industry
Plasma-enhanced Atomic Layer Deposition of Large-area MoS2: From 2-D Monolayers to 3-D Vertical Fins
Low-Temperature Atomic Layer Deposition of MoS2 Films
Dielectric-MoS2 Interfaces Grown by Atomic Layer Deposition
Plasma-Enhanced Atomic Layer Deposition of sub-5 nm high- k Dielectrics on 2D Crystals
Novel in-situ Electrical Characterization of the Atomic Layer Deposition Process on 2D Transition Metal Dichalcogenides Transistors
Deposition of MoS2 and WS2 from bis(tert-butylimido)-bis(dialkylamido) Compounds and 1-Propanethiol
Direct Growth of Layered Boron Nitride Films on MoS2 using Atomic Layer Deposition for 2D Based Nano-electronics
Fabrication of Functional Complex Nanostructures Based on ALD of BN and Their Potential Ability in Water Treatment
When There is no Bulk: Growth and Structure of Dielectric and Semiconductor Oxide Nanolaminates
Perfecting Single-Crystal Ternary Perovskite YAlO3 Epitaxial Growth on GaAs(111)A Utilizing Atomic Layer Deposited Sub-Nano-Laminated Y2O3/Al2O3
Thermal Coefficient of Resistance (TCR) Measurements for Atomic Layer Deposited Metal-Metal Oxide Nanocomposites
Phase Control of Ga2O3 Films Deposited by Atomic Layer Epitaxy
High Quality SiN and SiO2 Films Produced by PEALD with Microwave ECR Plasma Below 200 ºC
Tertiary Butyl Hydrazine as a Reducing Agent for Low-Temperature Atomic Layer Deposition of Low-Resistivity Copper Thin Films
Atomic Layer Processes to Enable the Atomic Scale Era
Thermal Atomic Layer Etching of SiO2 by a “Conversion-Etch” Mechanism
The Challenges and Opportunities in Plasma Etching of Functionally Enhanced Complex Material Systems
A Novel Process for Atomic Layer Etching of ZnO using Acetylacetone and Remote O2 Plasma
Determining the Benefits and Limitations of Atomic Layer Etching: A Modeling Investigation
